Chip Gallery

Temperature sensor and flash ADC

  • Process: TSMC 65nm low-power
  • Tapeout date: Sep. 2020.
  • No. of students: 2
  • Papers: SSDM’2021, A-SSCC’2021, JJAP’2022, SSDM’2022, JJAP’2023

RO array for variation and noise measurement

  • Process: TSMC 65nm low-power
  • Tapeout date: Sep. 2020.
  • No. of students: 2
  • Papers: ICMTS’2022, IOLTS’2021, IEEE-TSM’2023.

LDO and flash ADC

  • Process: TSMC 65nm general-purpose
  • Tapeout date: Sep. 2021.
  • No. of students: 2
  • Papers: NEWCAS’2022, ASP-DAC’2023, TCAS’2023.